If there are only three left to compete for the title of number one in engraving, the companies Intel, Samsung and TSMC do not mince their words with regard to the others.
The question of the fineness of semiconductor etching is a complex subject. There is no universal definition and behind the displayed fineness (measured in nanometers) there remain very different realities.
This is why Intel changed its name and rather than speaking in nm, it refers to Intel 3, Intel 20A and Intel 18A. Names that do not scare the number one in the sector, TSMC.
TSMC puffs out its chest
On the occasion of the presentation of the financial results of the Taiwanese group, CC Wei – the Managing Director of TSMC – also had very clear words to describe the situation of his company and its competitors.
“ We do not underestimate any of our competitors or take them lightly. That said, our internal evaluation shows that our N3P technology, now, I repeat, N3P technology has demonstrated comparable PPA to 18A, the competing technology, but with faster time to market, better technology maturity and much better cost.
In fact, let me say it again, our 2 nanometer technology without rear feed is more advanced than N3P and 18A, and will be the most advanced technology when introduced in 2025 “.
Nanosheet vs. nanoribbon vs. GAAFET
Beyond any controversy, this response to a question from Gokul Hariharan – analyst for JPMorgan Chase – about the competition that TSMC faces illustrates the confidence of the Taiwanese group.
A confidence that we first imagine to be “political” while Intel does not miss an opportunity to remind us that it is back and that it aims to overtake TSMC on 2 nm. The Intel 18A would therefore not scare TSMC, which nevertheless seems to encounter some difficulties with its latest processes (N3P in particular), which rely on more traditional power supply techniques.
CC Wei also emphasizes that TSMC’s 2nm technology (N2) is more advanced than competitors. Difficult to know if he is right, but let’s just remember that this “advance” is also the origin of several rumors about a possible postponement of N2: TSMC would have difficulty switching from FinFET transistors to its transistors ” nanosheet » which we know under the name of “ nanoribbon » at Intel or “ GAAFET » at Samsung.
Let us not forget that this race towards the infinitely small is currently in opposition between three giants: alongside TSMC – world number one – and Intel, there is also Samsung which remains well anchored in its second place and which does not hesitate to say that its 3 nm process is more efficient than that of TSMC. Communication war, when you hold us!
Source : Wccftech
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