MediaTek continues its race for power by delivering a new high-end SoC dedicated to smartphones and tablets: the Dimensity 9200. This chip ticks all the boxes to oppose fierce competition to Qualcomm, and potentially to its future Snapdragon 8 Gen 2.
Less and less hidden by the juggernaut Qualcomm, MediaTek continues to chart its course consistently in the field of high-end SoCs for smartphones and tablets. After the launch of its Dimensity 9000 and 9000 Plus (announced at the end of last year and this summer, respectively), the Taiwanese manufacturer is now formalizing its new Dimensiy 9000. The latter will have the difficult task of competing more or less frontally with the future Snapdragon 8 Gen 2 that Qualcomm should induct soon on its own top of the range.
To achieve this ambitious goal, MediaTek does not skimp on the means, relying again on TSMC’s 4 nm engraving, the same as its competitor should exploit. The Dimensity 9200 also displays a succession of enticing specifications, starting with support for LPDDR5X RAM at 8533 MHz and reduced consumption, according to MediaTek, by 25% compared to its predecessor.
MediaTek unleashes heavy artillery against Qualcomm
In the detail of its CPU part, the Dimensity 9200 brings together a powerful Cortex X3 core clocked at 3.05 GHz, three Cortex A715 cores clocked at 2.85 GHz and 4 high-efficiency Cortex A510 cores limited this time to a rate of 1, 80GHz. As pointed out WCCFTechhowever, it is not guaranteed that a smartphone will really be able to hold the 3.05 GHz course promised with the Cortex X3 core over the distance.
This frequency could however be observed briefly on performance peaks. It should also be noted that the distribution of the cores of the new SoC from MediaTek (1+3+4) is quite different from that anticipated for the future Snapdragon 8 Gen 2 (1+4+3). We will see if this is confirmed when said processor is announced this winter.
Anyway, MediaTek promises a 12% increase in performance in single-core compared to that offered last year by the Dimensity 9000, and 10% more power in the context of multi-core use. core. The manufacturer also promises to have thoroughly reviewed the thermal design of its chip to avoid any overheating problem. A concern that affected Qualcomm earlier this year, on the first generation of Snapdragon 8 Gen 1.
On the GPU side, the Dimensity 9200 promises native support for ray tracing, but also and above all 32% more performance and 41% less consumption compared to the iGPU of the Dimensity 9000, which is largely outclassed. This graphics part will also allow support for Full HD + screens at a maximum of 240 Hz, WQHD up to 144 Hz and 2.5K at 60 Hz.
MediaTek’s new chip also seeks to convince on the photo level, with support for RGBW capture thanks to an Imagiq 890 ISP (Image Signal Processor), which also offers 35% more performance on AI and a system improvement of sharpness on the moving image. Unsurprisingly, the Dimensity 9200 finally offers the best in connectivity with support for Wi-Fi 7, 5G mmWave, Bluetooth 5.3 and Bluetooth LE. This new SoC should arrive on the market at the end of the year on a first batch of smartphones.
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