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Mentioned at CES in January, the Ryzen 7000 series of processors was confirmed by AMD at Computex, which is currently being held in Taiwan. These CPUs will arrive in the fall. Engraved in 5 nm, they will use the Zen 4 architecture.
As expected, AMD is taking advantage of Computex in Taiwan to say a little more about its next generation of processors, the Ryzen 7000. No sensational revelation for the moment, it is more of a teasing broadly confirming what was already announced or leaked.
The Ryzen 7000s will take place on a new platform called AM5. This replaces the AM4 platform used since the first Ryzen launched in 2017. After five years on the same socket, AMD processors will take place on a version of the latter with 1718 connections (AM5). Designed to natively accommodate chips firing up to 170 W, the platform is also up to date by integrating the latest standards such as PCIe 5 (24 lines for storage and the graphics card), USB at 20 Gb /s, wifi 6e, Bluetooth LE 5.2, HDMI 2.1 and DDR5 memory. An appreciable point, the current AM4 compatible cooling systems will be directly compatible with the AM5 socket, without the need for an adapter. A really welcome point given the increasing price of these systems.
The processors themselves will be based on the Zen 4 architecture. A gain of more than 15% is expected on the performance of the cores in single thread (under CineBench R23). Data that does not tell us much, however, given the lack of detail. Under optimal cooling conditions, the cores will be able to exceed 5 GHz, demonstrated with the execution of the game Ghostwire Tokyo where the Ryzen 7000 used was “milling” at 5.5 GHz. The value is significantly higher than the maximum 4.9 GHz reached by the Ryzen 5000. Finally, we learn that the second level cache memory (L2) is doubled to reach 1 MB per core and that a set of instructions dedicated to the AI will be in order.
AMD has also offered a first representation of a Ryzen 7000 processor. We discover two chiplets each containing up to eight processor cores. This part will be engraved in 5 nm, i.e. a significant leap in engraving finesse compared to the 7 nm used on the current generation. Below, a new I/O chip is present. Although engraved in 6 nm, it benefits from a surface similar to the I / O chip of the Ryzen 5000, engraved in 12 nm for its part. The reason is quite simple: this part now directly integrates an RDNA graphics circuit. AMD seems to have changed tack by integrating an iGPU across its entire range of processors.
AMD also indicates that three chipsets will accompany the release of the Ryzen 7000. Very high-end motherboards will be based on the use of an X670 Extreme chip with the possibilities ofoverclocking extended and high PCIe link count 5 — unspecified. Just below, we will find the X670 chipset which will always offer theoverclocking processors, but to a lesser extent. The number of PCIe links 5 will allow the joint use of a graphics card and an SSD operating at this standard. Finally, the mid-range will be represented by the B650 chip which should not offer options foroverclocking. And if PCIe 5 is supported, it will only be for SSDs.
Note that AMD did not wish to discuss the performance of its processors against the competition. Strangely enough, reading the footnotes of the presentation made to the press tells us that a Ryzen 7000 is able to complete a 3D rendering in 204 s when a Core i9-12900K performs the operation in 297 s. However, the precise nature of the Ryzen 7000 is not given – in particular the number of cores – nor is the exact nature of the rendering software specified. The RAM is also not the same. Still, the 33% difference in favor of AMD bodes well for this series.
Finally, AMD wanted to specify the launch window for this new generation of processor, now expected during the fall. A presentation in September for availability in October seems to us to be the most conceivable scenario. By then, we should learn a bit more about the Zen 4 architecture of the Ryzen 7000s.