The semiconductor market is very competitive, but MediaTek is constantly coming up with new products. After having recently presented the Dimensity 9200 and 8200, it is today the turn of the Dimensity 7200 to be revealed. It should also be noted that this is the first chip from the manufacturer under the 7000 name. A new range of products therefore, which faces recent SoCs such as the Snapdragon 7 Gen 1 from Qualcomm.
The MediaTek Dimensity 7200. © MediaTek
It is an octa-core chip which is based on the same 4-nanometer etching process as the two SoCs mentioned above. This makes it possible in particular to produce chipsets that consume less energy while maintaining good (or even very good) performance in applications and in games.
On paper, the Dimensity 7200 shouldn’t lack power. MediaTek’s SoC is thus composed of two ARM Cortex-A715 cores clocked up to 2.8 GHz and six low-frequency Cortex-A510 cores for more modest tasks. Everything is accompanied by an APU supposed to improve battery management, but above all to improve the functions related to AI and photography. For storage, only UFS 3.1 is supported.
The graphics part is not left out since the chipset is equipped with a Mali-G610 MC4, GPU capable of supporting a refresh rate of 144 Hz up to Full HD +, but also the latest HDR10 + and Dolby HDR standards. It also embeds technologies related to the Hyper Engine 5.0, in particular Variable Rate Shading which increases in-game performance without visual sacrifice.
The SoC is also equipped with an Imagiq 765 image processor capable of managing a main sensor up to 200 Mpx and video in 4K HDR. It also supports double exposure in 1080p. Enough to offer a more interesting photo experience on affordable models.
We won’t have to wait too long to test its capabilities, because the first equipped mobiles should be announced during the first quarter of 2023. Suffice to say that they should appear at the MWC in Barcelona at the end of this month.