Gaming computers, ultrabooks and smartphones, this invention could revolutionize the cooling of our machines


Robin Lamorlette

December 08, 2022 at 1:15 p.m.

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AirJet © Frore Systems

© Frore Systems

What if our machines were cooled in future without fans? It is in any case the ambition of Frore Systems with AirJet.

The company has indeed announced a heat dissipation system for processors, graphics cards and SoCs devoid of a mechanical system, and operating instead via ultrasound.

The end of die-hard fans?

While the most widely used cooling method is based on fans, Frore Systems has developed a device similar to a passive dissipation solution based on ultrasound. To do this, the manufacturer has announced two models named AirJet Mini and AirJet Pro.

The idea of ​​these small 2.8 mm thick systems is to cool a fixed PC such as a laptop or even a smartphone and tablet by generating an active air flow without mechanical parts. Other advantages put forward by the company: an extremely thin cooling solution, with minimal noise pollution and low energy consumption.

Frore Systems argues that the AirJet Mini model could dissipate 5.25 watts while consuming only 1 watt and generating 21 decibels. The slightly larger AirJet Pro could dissipate 10.5 watts for a consumption of 1.75 Watts with 24 decibels in the program.

It’s not for now

However, we are not yet close to seeing this new cooling system, for which no date or price has been given. Frore Systems has however announced that it has established partnerships with Qualcomm and Intel in particular.

The brand would thus work with the engineers of these groups in order to evaluate the effectiveness of AirJet for a potential integration. In the more or less near future, Intel processors or Arc graphics cards, as well as Qualcomm SoCs could germinate with this new dissipation solution.

Frore Systems also indicated that several AirJets could be mounted in machines and combined in particular with other heat pipe cooling systems. The AirJets could thus be placed elsewhere than under the hood of a laptop computer, thereby reducing the heating problems of such a device.

For the time being, however, these are largely purely theoretical ideas. If the benefits of such a solution are attractive, what about potential drawbacks, particularly in terms of dust or humidity? An answer to these questions may be long overdue.

Source : Forre Systems



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