No rest for the brave, MediaTek is launching its Dimensity 8200 at the very end of the year. This new processor for mid-range smartphones should integrate a first salvo of devices in the coming weeks.
MediaTek continues to harass Qualcomm by launching ever beefier chips as an alternative to Snapdragon SKUs. Barely a month after the announcement of the Dimensity 9200 on the high end, the Taiwanese chip designer has found a little brother for it: the Dimensity 8200. This new octa-core SoC, engraved in 4 nm, is for its part designed to settle on the mid-range. It ditches a few features and refinements from the Dimensity 9200 to equip a whole range of more affordable smartphones… and presumably a few flagship killers along the way.
The first devices equipped with this new Dimensity 8200 should also arrive very soon on the market, MediaTek having specified that its chip will materialize on smartphones from this month of December. At this stage, however, the firm has not yet clarified which will be the first manufacturers concerned.
A very honorable firepower
Among the compromises made by the Dimensity 8200 is the abandonment of the Cortex-X3 and Cortex-A715 cores of the Dimensity 9200. Instead, MediaTek’s new mid-range chip settles for a Cortex-A78 main core (clocked at 3.1 GHz), supported by three high-performance Cortex-A78 cores (clocked at 3.0 GHz), and four high-efficiency Cortex-A55 cores (clocked for their part at 2.0 GHz).
This CPU part is here coupled with an Arm Mali-G610 MC6 graphics part, capable of supporting FHD+ screens up to 180 Hz and WQHD up to 120 Hz, precise XDA Developers. Perhaps more interestingly, the Dimensity 8200 also features a MediaTek Imagiq 785 HSR 14-bit ISP, capable of supporting a main photo sensor of up to 320 Mpx. This “chip in a chip”, dedicated to image processing, also allows video recording in 4K / 60 IPS, supports HDR double exposure in video, but also triple photo modules.
We can finally count on AV1 format decoding for 4K videos, as well as 5G sub-6GHz connectivity, Bluetooth 5.3 (with LE Audio) and Wi-Fi 6E. Predictably, there is also support for LPDDR5 RAM, in quad-chance, and support for the UFS 3.1 standard for local storage.
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