MWC 2022: Qualcomm integrates AI for the first time in its new 5G modem


Qualcomm on Monday unveiled the latest generation of its 5G modem-RF system, the Snapdragon X70 – the first-ever 5G modem-antenna system with an integrated AI processor. With the addition of artificial intelligence (AI), the modem can help 5G devices deliver faster speeds, better coverage and latency, and better power efficiency, as the US processor specialist argues. “What AI has already brought to cameras, audio, sound, it will be able to do for 5G too,” Nitin Dhiman, Qualcomm’s 5G product marketing manager, told ZDNet.

This new AI-powered 5G modem is one of many connectivity announcements that Qualcomm unveiled this week during Mobile World Congress (MWC). The company also unveiled products and capabilities that take Qualcomm technology far beyond the smartphone market. Embedding AI on its 5G modem enables Qualcomm to expand its business in the area of ​​connected and intelligent peripherals, explained Mike Roberts, vice president of global marketing at Qualcomm, during a press briefing held at the end of the week. last.

“This connected, intelligent edge will be a critical part of cloud growth,” he said. And to recall that, “in a few years, more than 60% of data will be processed outside the central cloud”.

With its entry into the connected and intelligent edge market, as well as the emergence of the metaverse, Qualcomm claims that its total addressable market (TAM) will grow from $100 billion to $700 billion over the next 10 years. Coming back to connectivity, the new Snapdragon X70 has an AI suite designed for AI-powered optimizations for millimeter bands. The modem offers standalone mmWave support without the need for sub-6 spectrum. It also supports dual-SIM-dual Active (DSDA), which means that device users can have more than one SIM active in their device for different applications.

Launch by the end of 2022

Qualcomm’s on-chip AI platform will further enable the development of new technologies such as AI-based smart grid detection and selection, AI-based millimeter beam management, feedback and optimization. AI-based channel status and AI-based dynamic antenna tuning. Qualcomm expects customers to begin sampling the Snapdragon X70 in the second quarter of 2022, and 5G devices equipped with the modem will launch by the end of the year.

Qualcomm also took advantage of the MWC, the high mass of global telecommunications currently taking place in Barcelona, ​​to unveil the latest generation of its FastConnect mobile connectivity system for Wi-Fi and Bluetooth, and its new flagship FastConnect 7800 for Wi-Fi. 7. Qualcomm’s FastConnect system is already present in more than 500 Wi-Fi 6 and Wi-Fi 6E designs, and more than 200 are in development, covering mobile computing, XR and other product categories . The new FastConnect 7800 is 60% faster than the previous generation, with speeds of 5.8 Gbps delivering 50% lower latency and 50% lower power.

One of the main differentiating factors lies in the Multi-Link High Band Simultaneous (HBS) technology developed by Qualcomm, which allows multiple and simultaneous connections at 5 GHz and/or 6 GHz. These products will be identifiable via a badge intended to indicate that the devices are equipped with Qualcomm technologies. This badge will apply to all Snapdragon-equipped devices, from phones to XR devices, watches and even automobiles.

A cascade of announcements

Beyond the smartphone market alone, Qualcomm does not forget its other activities. The American giant thus announced on Monday that it was equipping the first Lenovo ThinkPad based on Arm technology. The ThinkPad X13s features the Snapdragon 8cx Gen 3 computing platform announced last year.

Qualcomm is also bringing a new version of its “Digital Chassis” to the automotive market, a set of cloud-connected platforms for telematics, connectivity, digital cockpit, driver assistance and autonomy. Among other updates, the Digital Chassis will now offer connectivity as a service. This feature will support out-of-the-box connectivity, built-in analytics, and a cloud and device development environment.

In the industrial field, Qualcomm announced its collaboration with Gridspertise, a subsidiary of the Enel group, to digitally transform electrical networks. Gridspertise recently launched the QEd -Quantum Edge device for digital substations, which uses Qualcomm’s Internet of Things solutions.

The global specialist in mobile components has also announced that it wants to continue innovating in the field of 5G wireless as an alternative broadband solution to DSL, cable and fiber. The company is leveraging its 5G Fixed Wireless Access (FWA) platform with next-gen features such as support for standalone 5G mmWave technology and the Qualcomm 5G RF Sensing Suite.

Qualcomm also announced its work with Mavenir and the creation of an expanded portfolio of Open RAN solutions. The new Mavenir products, powered by Qualcomm 5G RAN platforms, will be designed to simplify network deployments and accelerate global adoption of cloud-based open RAN mobile networks.

Source: ZDNet.com





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