Again processors for new motherboards and new cooling systems. Will everything still have to be changed?
Without knowing very well how he obtained this information, Igor’s Lab came across a dedicated mine at Arrow Lake.
1,851 contact pins
The future generation of Intel processors, which should not tumble before the fall of 2024 at best, has thus already been the subject of interesting projections as to its performance.
Today, Igor’s Lab provides an update on the support for this new range of processors. Indeed, Intel has planned to put the LGA1700 socket in the closet from the next generation. It will be the LGA1851 which will replace it for the Arrow Lake ranges and, probably, Lunar Lake which should not arrive before 2025 in the best case.
As the name suggests, the LGA1851 is a Land Grid Array carrier with 1851 pins. Remember that at Intel, the LGA came to replace the PGA from 2004, with the main contribution of moving the pins of the processor to the PCB of the motherboard.
Greater pressure on the PCB
But that’s not really what concerns us today, insofar as this information had already been revealed. On the other hand, Igor’s Lab is the first to release official LGA1851 schematics.
Obviously, on such patterns, the most important things concern all the odds around the support. Indeed, despite the 1,851 pins, the LGA1851 processor package will be the same size as the LGA1700 at 45 x 37.5 millimeters. In other good news, the end of the integrated heat spreader (IHS) that overhangs the CPU will be the same distance from the motherboard PCB.
All in all, one could almost assume that the current cooling solutions (LGA1700) will be directly compatible with the LGA1851. But that would be too simple. Indeed, it seems that the new attachment requires more pressure, and therefore cooler manufacturers will have to adapt their products. Some will, even for free, others probably won’t.
Source : Igor’s Lab
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