Qualcomm used to unveil its high-end chips (Snapdragon 8 Gen x) at the beginning of December. But the American firm could do it a little earlier this year, its Tech Summit being announced for mid-November.
Rumors about the Snapdragon 8 Gen 2, Qualcomm’s new premium chip, are rife. The SoC in question could be unveiled at the next Snapdragon Tech Summit, which will be held from November 14 to 17. An earlier date than usual, given that this meeting has been taking place for several years at the end of November or the beginning of December.
According to leaker Digital Chat Station, the chip in question should still use a 4-nanometer engraving process, signed TSMC. It would adopt four different types of cores, with a 1+2+2+4 structure, while most SoCs have three (1+3+4). In fact, this could allow the chip to better adapt to various usage scenarios. However, it is possible that this new distribution of tasks between the different cores is more complex to implement.
We would thus find a main Cortex-X3 core, two Cortex-A720 cores, two Cortex-A720 cores and three Cortex-A510 cores of lower consumption. They would probably be supported by an Adreno 740 GPU.
The Xiaomi 13 and 13 Pro, which are scheduled for release at the end of November, could be the first smartphones to be equipped with it. Other high-end devices would follow during the month of December.