Thermalright launches an accessory to avoid “folding” Alder Lake CPUs


Nerces

Hardware and Gaming Specialist

April 22, 2022 at 11:30 a.m.

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Thermalright LGA1700-BCF © Thermalright

© Thermalright

Unevenly distributed pressure on the surface of the processors Intel Alder Lake could be the cause of a “twist” of the CPU.

Mentioned several times in recent days, the news is controversial among processor specialists. Indeed, several experts have noticed that the LGA1700 socket tends to “bend” 12th generation Intel CPUs.

Universal compatibility?

Of course, there is no question of ending up with a Samsung Fold-style Alder Lake. Intel has also commented on the subject, explaining that this had no impact on the proper functioning of its chips and that no action was therefore planned on its side.

Thermalright LGA1700-BCF © Thermalright

© Thermalright

Faced with the concern of some users, the Thermalright brand has nevertheless decided to act. His idea takes the form of a small insert that strongly resembles the “3D printing” solutions of some clever people. The accessory is called “LGA1700-BCF” for Bending Corrector Frameor bend correction frame, and should be available now for around $6.

If it is announced compatible with the H610, B660 and Z690 motherboards, the question arises however of its proper functioning with all models and, of course, of its availability in Europe.

On the same subject :
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Source : VideoCardz



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