With a small lead over its most direct competitors in the field of high-tech engraving, TSMC is seeking to further accelerate the pace to keep this gap with Intel and Samsung.
Rapidly improving fineness of engraving bodes well for the next generations of processors and graphics cards.
3 nm on the future Ryzen 8000 in particular
The Taiwanese founder actually took advantage of the presentation of its quarterly financial results to take stock of its future processes, with, of course, the N3 and the N2.
The first of the two, which symbolizes an engraving in 3 nm, should therefore enter mass production even before the end of the year. TSMC talks more broadly about the “ second half of 2022 “. In addition, the manufacturer is preparing an improved version of this process for better performance early next year, the NE3.
In addition, and even if things are logically a little more vague, TSMC is also progressing on the N2, for an engraving in 2 nm. There, there is talk of a pre-production phase from 2024, for larger-scale production in 2025.
Note in passing that the transition to the N2 process will be an opportunity for TSMC to switch to GAA transistors, for Gate All-Around, leaving aside the FinFET transistors, which have been used for years.
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Source : TechSpot
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