Wendel: carries out a bond issue of 300 ME – 06/12/2023 at 6:21 p.m.


(CercleFinance.com) – Wendel announces the successful placement, completed today, of a €300 million bond issue maturing in June 2030 with a coupon of 4.5%.

The issue was a huge hit with investors and was more than 2.5 times oversubscribed. The bonds were placed mainly with French (27%), German, Austrian and Swiss (51%) and British (5%) investors.

The net proceeds of this issue will be used in particular for the Group’s general financing needs, including the buyback of the April 2026 bonds which will be tendered to the buyback offer announced today.



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