Very good news while waiting for the release of another version with the famous 3D Vertical Cache ?
The release of the Ryzen 7000 processors was to be AMD’s big comeback, a triumph after the successes of the previous ranges. Alas, a month later, the American sulked and sales were not looking good.
Too expensive, too hot?
As for motherboard manufacturers – but all this unofficially of course – they mainly criticize the cost of the brand’s chipsets: the AMD X670/X670E would be far too expensive and the B650/B650E still too expensive.
We can also highlight the need to change RAM and the additional cost generated by DDR5. AMD had however taken care to ensure compatibility with the cooling solutions inherited from the previous generation, in AM4.
Unfortunately, even this good deed backfired on AMD, which seems to have had to design an IHS (integrated heat spreader) thicker than normal. As a result, the temperature of its processors soars, especially on large models like the Ryzen 9 7950X.
65 Watts of TDP
During the test of the spearhead of the new range, but also of the Ryzen 9 7900X and the Ryzen 7 7700X, we noticed that limiting the power delivered logically reduced the temperature of the latter.
More importantly, it avoided drastic heating without limiting performance too much. Could AMD’s answer come from a change in TDP for the next Ryzen 7000?
In any case, this is implied by a rumor relayed by Videocardz. It evokes the probable release of a Ryzen 7 7700 without “X” behind, a CPU with 8 cores like its big brother, but whose TDP will be limited to 65 Watts against 105 Watts for the 7700X.
Note that this is only one of AMD’s responses to give its Ryzen 7000 a little fishing. We are still awaiting an announcement confirming the release of an X3D processor, vertical stacking technology to boost the amount of onboard cache.
Source : Videocardz
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