Ever thinner, ever more efficient. According to information obtained by the DigiTimes media, the famous founder TSMC is preparing to launch the production of 3 nm chips this week. News that should delight Apple, which is waiting for this new generation of processors on a firm footing.
3nm for Macs
The first 3 nm chips intended for commercial use should therefore leave the Taiwanese manufacturer’s factories on December 29, 2022, a timing in accordance with the roadmap detailed by TSMC last June. The first components will be built in the Fab 18 factory in Taiwan, which aims to produce up to 55,000 wafers per month in an attempt to meet demand.
Indeed, the demand for 3 nm chips is, first and foremost, driven by Apple, which would like to embed these new generation processors in its iPhones, iPads and Mac computers. The M2 Pro and M2 Max chips, which have been talked about for months now, could be the first to inaugurate this new burning process which allows great flexibility thanks to the use of FinFlex technology. What finally release the Mac Pro Silicon which is long overdue.
And for iPhones
But that’s not all, the iPhone 15 could also carry a 3 nm chip. At least some iPhone if we are to believe the rumors of this end of the year. Future iPhone “Pro” should be based on an A17 chip using N3E technology (based on 3 nm engraving) to offer better performance and lower power consumption. Apple’s future M3 chip should also use the N3E process that TSMC should inaugurate in the course of 2023.
With so many products dependent on this leap to 3 nm, we understand that Apple is rushing to the gate to recover the first 3 nm chips produced by TSMC.