Apple plans to use an updated version of Taiwanese semiconductor giant TSMC’s latest chip-making technology in iPhones and MacBooks starting in 2023, the Japanese daily reports on Wednesday. Nikkei Asia.
If the Taiwanese foundry wins this mega-contract, it will be responsible for equipping Apple’s “house” mobile processor, the A17 processor currently under development. This will eventually be mass-produced using TSMC’s N3E chip fabrication technology, which is expected to be available in the second half of next year.
The A17 mobile processor will be used in the high-end model of the iPhone lineup scheduled for release in 2023. As a reminder, the current iPhone model is equipped with an A15 processor chip, which will also equip iPhones. 14 Pro. If the contract is confirmed, TSMC would strike a new blow on the semiconductor market. The Taiwanese chipmaker now controls around 54% of the global market for chips produced under contract and has established itself in recent years as a strategic supplier for companies such as Apple and Qualcomm.