In the race to offer the densest and most efficient mobile processors, MediaTek may take home the gold. The Taiwanese founder has in fact announced on its site that it has succeeded in creating its first premium smartphone processor engraved in 3 nm.
To make this new Dimensity SoC engraved in 3 nm, MediaTek collaborated with TSMC. According to their press release, production of this processor should begin next year. The advantages of this new chip should result not only in a performance gainbut also by a lower energy consumption.
According to MediaTek, “compared to TSMC’s N5 process, 3nm technology offers 18% increase in clock frequency at equal power consumptionor a reduction in consumption of 32% at the same speed, and an increase of approximately 60% in component density.
MediaTek and TSMC have created a 3nm chip that will equip 2024 flagships
According to MediaTek, this revolutionary processor will equip high-end smartphones from the second half of 2024. But whatever Joe Chen, the president of the company, says, it is indeed Apple which will offer, this fall, a smartphone with a chip engraved in 3 nm: the iPhone 15 with an Apple A17 Bionic SoC. Furthermore, Samsung presented its first GAA chip a little over a year ago. Even if according to the Korean giant, it will first be used for industrial purposes, the telephone giant will likely offer versions for smartphones. Will it be theExynos 2500, the famous Dream Team chip ? We will have to wait until 2025 to see it firsthand, in the Galaxy S25, perhaps.
Which manufacturers will use Dimensity 3 nmof MediaTek in their flagships next year? We cannot comment on this point either, but we know that the Taiwanese company has strong relationships with Chinese smartphone manufacturers. So, while the Find X5 Pro normally integrates a MariSilicon X processor, Oppo did not hesitate to launch a special model, the Oppo Find X5 Pro Dimensity Edition.